In high-end sensor manufacturing, the difference is not just in the chip or algorithm — it is in packaging and welding.

For applications in semiconductors, biopharma, and medical devices, even microscopic leaks or contamination can compromise measurement accuracy and long-term reliability. That’s why we combine Laser Welding and TIG Orbital Welding, ensuring both cleanliness and sealing integrity from the inside out.

🔵 Laser Welding – Precision & Purity

• Micron-level precision; weld purity 99.99%, ensuring zero leakage

• Minimal heat impact to protect sensitive components

• Non-contact process: no filler, no flux, no oil contamination

• Leakage rate ≤ 10⁻⁹ mbar·L/s, compliant with vacuum and high-pressure standards

🔵 TIG Orbital Welding – Core Process Reliability

• Seamless fusion with base material; surface roughness Ra ≤ 0.18 μm after electro-polishing

• Welding consistency ≥ 99.5%

• Automated orbital control with inert gas ensures high-pressure and high-temperature reliability

• Each weld is inspected via borescope and helium leak testing

Results

By eliminating welding-related failure risks at the source, our approach delivers over 30% improvement in long-term sensor stability.

If your application demands ultra-clean, leak-tight, and long-term stable sensing, we can support evaluations, pilot tests, and engineering discussions.